This week we’ve seen the Exynos 2600 post impressive results on Geekbench and 3DMark. Reports from Korea claim that Samsung has developed a cool new trick for this chip – a Heat Pass Block (HPB) that promises to cool the application processor (AP) better than previous approaches.
A “chipset” is just that – several chips, usually arranged in a package-on-package structure, which places the RAM on top of the application processor (this is the silicon die that holds the CPU, GPU, NPU and other components).
The Heat Pass Block adds another layer to that stack – a copper heat sink. This is similar to the heat spreaders that are typical in modern designs. Heat spreaders, however, are added after the package-on-package structure has been assembled.
The advantage of the HPB is that it is much closer to the source of the heat, which should allow it to pull heat away more efficiently.
An example of package-on-package stacking, without an HPB
The Exynos 2600 will be fabbed on Samsung’s 2nm Gate-All-Around (GAA) process and is expected to ship with the Galaxy S26 series. We wouldn’t be surprised to see a Snapdragon chip in some or all Galaxy S26 Ultras. However, whether the other S26 models get the Z Flip7 treatment (Exynos in all markets) or whether chip selection varies by market remains to be seen.
Samsung is expected to complete quality testing of the Exynos 2600 and should officially unveil the chip around the same time. The Galaxy S26 series should be out in late January or early February.
Source (in Korean)