Chinese smartphone makers are trying their best to be more self-reliant but few have cracked the complicated task of developing their own in-house chipset, let alone one that can compare with the flagship offerings from Qualcomm and MediaTek. Well, Xiaomi has done just that as the company has a new top-tier chipset – the Xring O1 which was just announced alongside its latest Xiaomi 15S Pro flagship.
While the device is basically identical to the Xiaomi 15 Pro, the Xring O1 chip inside is a big breakthrough for Xiaomi. Developed and designed by Xiaomi and fabbed on TSMC’s second-generation N3E 3nm process, Xring O1 features a ten-core CPU cluster with 2x Cortex-X925 prime cores clocked @ 3.9GHz, 6x Cortex-A725 performance cores between 1.9-3.4 GHz and 2x Cortex-A520 efficiency cores @ 1.8 GHz.
The CPU is joined by a 16-core ARM Immortalis-G925 GPU and a 6-core NPU rated at 44 TOPS.
Xiaomi revealed that its flagship SoC scored over 3 million points on the AnTuTu benchmarking platform, edging out the Snapdragon 8 Elite. Xring O1 also managed over 3,000 single core points and 9,000 multi-core points in Geekbench 6, with the multi-core score edging out Apple’s A18 Pro.
Xring O1 supports the latest LPDDR5T RAM, UFS 4.1 storage, USB 3.2 Gen2 connectivity, Wi-Fi 7, and a custom 3-core Xiaomi ISP.
Outside of the chipset swap, the rest of the specs are identical to those of the Xiaomi 15 Pro. These include a 6.73-inch LTPO AMOLED (QHD+ 120Hz), three 50MP cameras (ultrawide, wide and a 5x periscope) and a 6,100mAh silicon carbon battery with 90W wired charging. The 15S Pro boots Xiaomi HyperOS 2, based on Android 15, and comes in Black and Blue.
The 16/512GB trim starts at CNY 5,499 ($763) while the top-tier version with 1TB storage is priced at CNY 5,499 ($832). Open sales in China are already underway. Xiaomi did not detail international launch plans for now.
Source (in Chinese)